After the expiration period, the slabs are unclenched and the device 19 unloads all the plates from the press to the unloadingthe 20. Special mechanism 21 separates the plates from pallets. Ready slabs are laid on the elevator, from where the fork lift is transported to the room for aging 22.
After exposure for 5-7 days, the slabs are made for trimming from four sides on machine gun 23 and are consistently polished on both sides on sinful grinding machines 24 and 25. The slabs are laid on the elevator 26, where they are transported to the warehouse.
Patins freed from the slabs by device 21 are transmitted by transverse transporter 27 to the longitudinal conveyor 15. On the way to the place of formation of the chip layer, the pallets are blown and cooled in chamber 28. Next, the device 14 lays a forming frame on the pallets.
Patins with the frames of the transverse chain transporter 29 are transferred to the transporter 10 to fill with chips. The production scheme of the three -layer plates of Bekker and Van Hullen, carried out at Klaipeda, Vitebsk and Apheron factories is more advanced. Here, shavings for the front and middle layers are prepared separately on two technological lines.
As a raw material for the facial layer is used, wood -wooden round. Meter churaki are soaked in pool 1, with hot water in containers 2, after which the circle is cleaned from the bark in the hammer drums 3. Then the churaks with saws 4 are cut into segments 33 cm long, which are loaded with a tape transporter 5 into a distributor 6, serving several chip machines 7 with horizontal knife disks.
The resulting thin chips with pneumatic transport are loaded into the raw chips bunker. The dosing device of the bunker 8 loads the chips into the receivers of the crushers 9, where it is subjected to additional grinding in width. The crushed chips enters the pneumatic (aerofonan) dryer 10, where it is not only dried, but also sorted.
Conditioning dry chips from the chamber enters the vibration daner, 11, and then to the strip dispenser 12. The latter loads the chips into the receiving funnel of the continuous action mixer 13. A working adhesive solution prepared at the installation of 14-15 is also supplied here through pipes of capacities 16.
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